UTS Technologies, Ltd.
Production Specification
| System Configuration | |
|---|---|
| Wafer size | 50, 75, 100, 125, 150 mm |
| Stage Type | DC Linear motor drive |
| Vibration Control | Active Air Isolation |
| Computer Type | PC Computer |
| Color Graphics Monitor | |
| Wafer Handling | Cassette-to-cassette or interface-to-track, |
| SEMI and JEIDA standard | |
| Reticle Handling | N/A |
| Image and Lens | |
| Feature size | 1.0 um |
| Usable depth of focus | ±1.5 um |
| Lens distortion | |
| (100% of data) | ≤ 120 um |
| Maximum image area | 30x18 mm |
| largest square* | |
| Exposure Spectrum | Broadband gh-line, 390-450 nm |
| illumination | |
|---|---|
| Wafer plane intensity | ≥ 600 mw/cm² |
| alignment | |
| WAS | 500 nm (3σ) |
| MVS | 500 nm (3σ) |
| throughput (wafers per hour at 100 mj/cm² | |
| 125 mm wafer | |
| 150 mm wafer | |
| 200 mm wafer | |
| reticle | |
| Substrate type | 3x5x0.09 inch quartz |
| Field per reticle row | 2-4 field |